United Microelectronics Corporation (UMC), a global leader in semiconductor foundry services, has officially opened its new fab facility in Singapore. The first phase of the facility, located in the Pasir Ris Wafer Fab Park, is set to commence volume production in 2026, significantly increasing UMC’s production capacity in Singapore to over 1 million wafers annually. This expansion is anticipated to generate approximately 700 local jobs, including roles for process and equipment engineers as well as research and development engineers.
The grand opening ceremony was attended by prominent figures, including Singapore’s Deputy Prime Minister and Minister for Trade and Industry, Gan Kim Yong, and Senior Minister Teo Chee Hean. The facility represents a greenfield expansion adjacent to UMC’s existing fab, with an investment of up to $5 billion to achieve a full capacity of 30,000 wafers per month. The new fab will utilise UMC’s advanced 22nm and 28nm solutions, catering to global demand for premium smartphone display chips, power-efficient memory chips for IoT devices, and next-generation connectivity chips.
SC Chien, President of UMC, stated, “This new state-of-the-art facility in Singapore signals a new phase of growth for UMC. It enhances our ability to meet future chip demand, driven by continuous innovations in connectivity, automotive, and AI.”
The facility has been designed with sustainability in mind, achieving the Green Mark GoldPlus certification from Singapore’s Building and Construction Authority. It features 17,949 square metres of solar panels and includes amenities such as a new office building and a multipurpose sports hall for employees and the community.
Jermaine Loy, Managing Director of the Singapore Economic Development Board, remarked, “This significant investment underscores our long-standing partnership with UMC, and we look forward to deepening our collaboration to strengthen Singapore’s semiconductor ecosystem.”
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